Ultrasonic Ring Chips & Langevin Transducers

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PKT40A Langevin Transducer (Left), Connector (Center), and Sonotrode/Horn (Right)

Features

• Chips of Hard PZT Material Designed for Ultrasonic Welding, Cleaning, Sensing, and Other Resonant Vibration Applications
• Two Ring Chips Available with Bare Electrodes:
  • 35 kHz, 50 mm OD, 17 mm ID, and 6.5 mm Long
  • 26 kHz, 60 mm OD, 30 mm ID, and 10 mm Long
• Langevin Transducers with Metal Housing for
  Ultrasonic Welding
• Drive Voltage Range of 0 - 5 kV
• Custom Options Available; Please Contact OEM Sales

Thorlabs offers hard PZT material ring elements as chips with bare electrodes for use in ultrasonic vibration applications and integrated into Langevin transducers designed for use in ultrasonic welding.

The PA40ND5 Ring Chip with 50 mm outer diameter (OD), 17 mm inner diameter (ID), and 6.5 mm thickness provides a 35 kHz resonant frequency as the work frequency; our PKT40A Langevin Transducer with four PA40ND5 chips provides a 20 kHz resonant frequency as the work frequency and an instantaneous power of 700 W. The PA40TM Ring Chip with 60 mm OD, 30 mm ID, and 10 mm thickness provides a 26 kHz resonant frequency as the work frequency; our PKT40B Langevin Transducer with four PA40TM chips provides a 15 kHz resonant frequency as the work frequency and an instantaneous power of 500 W.

The hard PZT material in these ultrasonic piezo chips and transducers can be driven at up to 5 kV, but operation above 3 kV may create an arc in the air. Protective measures such as silicone oil should be applied when the voltage is above 3 kV; for a complete list of specifications, see the tables below. We recommend driving clamped chips or transducers using a sine wave at the work frequency with a voltage of 0 - 5 kV. The graphs in the info icons in the tables below illustrate the sharp phase angle slope around the resonant frequency of the devices. The sharp phase angle slope is useful for tracking the resonant frequency which may shift during operation due to temperature changes.

Thorlabs' piezoelectric chips are individually inspected using a proprietary AI algorithm to ensure the highest quality of our line of piezo chips, actuators, and transducers.

Hard vs. Soft PZT Material
Soft PZT material has a large piezoelectric constant and is ideal for actuators in motion control applications. However, soft PZT has a relatively high dielectric loss factor of ~2% and would generate excessive heat when driven at high frequencies. We recommend using soft PZT actuators at less than 33% of their resonant frequency. Hard PZT material has a low dielectric loss factor and a high mechanical quality factor, making it ideal for high frequency driving and even resonant frequency driving. Driving hard PZT at its resonant frequency will generate maximum vibration amplitudes. The stroke or vibration displacement is harder to control at high frequencies, compared to soft PZT at low frequencies. The vibration of hard PZT is always used to generate vibration waves. When the resonant frequency is higher than the audible frequency range, the generated waves are termed ultrasonic waves and the device is called an ultrasonic transducer. These waves can be used for ultrasonic welding by rapid friction and heating, ultrasonic detection by wave reflection, and ultrasonic cleaning.

Piezo chips with custom dimensions, voltage ranges, and coatings are available. Additionally, customers can order these piezo chips in high-volume quantities. Please contact OEM Sales for more information.

Thorlabs' In-House Piezoelectric Manufacturing

Our piezoelectric chips are fabricated in our production facility in China, giving us full control over each step of the manufacturing process. This allows us to economically produce high-quality products, including custom and OEM devices. A glimpse into the fabrication of our piezoelectric chips follows. For more information about our manufacturing process and capabilities, please see our Piezoelectric Capabilities page.

• Build Blocks from Lead Zirconate Titanate (PZT) or BiScO₃-PbTiO₃ (BSPT) Powder
• Dry Press PZT Powder into Ring Elements with Binder in a Mold
• Purge Solvent and Binder Material Residues by Heat Treating the Elements
• Sinter the Elements to Fuse the Piezoelectric Pressed Powder and Grow PZT or BSPT Crystals
• Lap the Elements to Achieve Tight Dimensional Tolerances: ±0.2 mm for Each Element
• Screen Print the Outer Electrodes on the Elements
• Align the Individual PZT or BSPT Crystals Along the Same Axis by Poling the Elements

Storage Instructions

• Do not store the device at temperatures above 200 °C.
• Do not store the device in humid environments. The relative humidity (RH) should be less than 40%.
• Do not immerse the device in organic solvents.
• Do not use the device around combustible gases or liquids.